Product Details
Model Number: SPS50B12G3H6
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Solid Power-DS-SPS50B12G3H6-S04010020 V-3.0
1200V 50A IGBT Half Bridge Module
Features:
□ 1200V Trench+ Field Stop technology
□ Freewheeling diodes with fast and soft reverse recovery
□ VCE(sat) with positive temperature coefficient
□ Low switching losses
Typical Applications:
□ Welding
Package
Item | Symbol | Conditions | Values | Unit | |||
Isolation test voltage |
VISOL | RMS, f = 50 Hz, t =1 min |
4.0 |
kV |
|||
Material of module baseplate |
Cu |
||||||
Internal isolation |
(class 1, IEC 61140) Basic insulation (class 1, IEC 61140) |
Al2O3 |
|||||
Creepage distance |
dCreep | terminal to heatsink | 17.0 |
mm |
|||
dCreep | terminal to terminal | 20.0 | |||||
Clearance |
dClear | terminal to heatsink | 17.0 |
mm |
|||
dClea | terminal to terminal | 9.5 | |||||
Comparative tracking index |
CTI |
>200 |
|||||
Item | Symbol | Conditions | Values | Unit | |||
Min. | Typ. | Max. | |||||
Stray inductance module |
LsCE |
20 |
nH |
||||
Module lead resistance, terminals - chip |
RCC’+EE’ | TC=25℃ |
0.65 |
mΩ |
|||
Storage temperature |
Tstg |
-40 |
125 |
℃ | |||
Mounting torque for module mounting |
M6 |
3.0 |
5.0 |
Nm |
|||
Terminal connection torque |
M5 |
2.5 |
5.0 |
Nm |
|||
Weight |
G |
150 |
g |
IGBT
Item | Symbol | Conditions | Values | Unit | |
Collector-emitter Voltage |
VCES | Tvj=25℃ |
1200 |
V |
|
Maximum gate-emitter voltage |
VGES |
±20 |
V |
||
Transient gate-emitter voltage |
VGES | tp≤10μs,D=0.01 |
±30 |
V |
|
Continuous DC collector current |
IC | TC=25℃ | 80 |
A |
|
TC=100℃ | 50 | ||||
Pulsed collector current,tp limited by Tjmax |
ICpulse |
100 |
A |
||
Power dissipation |
Ptot |
326 |
W |
Characteristic Values
Item | Symbol | Conditions | Values | Unit | |||
Min. | Typ. | Max. | |||||
Collector-emitter saturation voltage |
VCE(sat) | IC=50A, VGE=15V | Tvj=25℃ | 2.07 | 2.55 |
V |
|
Tvj=125℃ | 2.49 | ||||||
Tvj=150℃ | 2.61 | ||||||
Gate threshold voltage |
VGE(th) | VCE=VGE, IC=2mA |
5.2 |
5.7 |
6.3 |
V |
|
Collector-emitter cut-off current |
ICES | VCE=1200V, VGE=0V | Tvj=25℃ | 100 | µA | ||
Tvj=150℃ | 5 | mA | |||||
Gate-emitter leakage current |
IGES | VCE=0V,VGE=±20V, Tvj=25℃ | -200 | 200 | nA | ||
Gate Charge |
QG | VCE=600V, IC=50A , VGE=±15V | 0.25 | μC | |||
Input Capacitance |
Cies | VCE=25V, VGE=0V, f =100kHz | 3.0 |
nF |
|||
Reverse Transfer Capacitance |
Cres | 0.12 | |||||
Internal gate resistor |
RGint | Tvj=25℃ | 2.8 | Ω | |||
Turn-on delay time,inductive load |
td(on) | VCC=600V,IC=50A RG=15Ω, VGE=±15V | Tvj=25℃ | 52 | ns | ||
Tvj=125℃ | 49 | ns | |||||
Tvj=150℃ | 49 | ns | |||||
Rise Time,inductive load |
tr | Tvj=25℃ | 27 | ns | |||
Tvj=125℃ | 30 | ns | |||||
Tvj=150℃ | 31 | ns | |||||
Turn-off delay time,inductive load |
td(off) | VCC=600V,IC=50A RG=15Ω, VGE=±15V | Tvj=25℃ | 192 | ns | ||
Tvj=125℃ | 230 | ns | |||||
Tvj=150℃ | 240 | ns | |||||
Fall time,inductive load |
tf | Tvj=25℃ | 152 | ns | |||
Tvj=125℃ | 202 | ns | |||||
Tvj=150℃ | 207 | ns | |||||
Turn-on energy loss per pulse |
Eon | VCC=600V,IC=50A RG=15Ω, VGE=±15V | Tvj=25℃ | 3.3 | mJ | ||
Tvj=125℃ | 5.2 | mJ | |||||
Tvj=150℃ | 5.9 | mJ | |||||
Turn off Energy loss per pulse |
Eoff | Tvj=25℃ | 2.3 | mJ | |||
Tvj=125℃ | 3.0 | mJ | |||||
Tvj=150℃ | 3.2 | mJ | |||||
SC data |
ISC | VGE≤15V, VCC=800V | tp≤10µs Tvj=150℃ |
260 |
A |
||
IGBT thermal resistance,junction-case |
RthJC | 0.46 | K /W | ||||
Operating Temperature |
TJop | -40 | 150 | ℃ |
Diode
Maximum Rated Values
Item | Symbol | Conditions | Values | Unit | |
Repetitive reverse voltage |
VRRM | Tvj=25℃ |
1200 |
V |
|
Continuous DC forward current |
IF |
50 |
A |
||
Diode pulsed current,tp limited by TJmax |
IFpulse |
100 |
|||
I2t-value |
I2t |
490 |
A2s |
Characteristic Values / 特征值
Item | Symbol | Conditions | Values | Unit | |||
Min. | Typ. | Max. | |||||
Forward voltage |
VF | IF=50A , VGE=0V | Tvj=25℃ | 2.11 | 2.60 |
V |
|
Tvj=125℃ | 1.85 | ||||||
Tvj=150℃ | 1.75 | ||||||
Peak reverse recovery current |
IRRM |
IF=50A dIF/dt=-1300A/μs (Tvj=150°C) VR=600V, VGE=-15V |
Tvj=25℃ | 59 |
A |
||
Tvj=125℃ | 83 | ||||||
Tvj=150℃ | 90 | ||||||
Reverse recovery charge |
QRR | Tvj=25℃ | 2.0 |
µC |
|||
Tvj=125℃ | 6.5 | ||||||
Tvj=150℃ | 8.9 | ||||||
Reverse recovery energy loss per pulse |
Erec | Tvj=25℃ | 0.3 |
mJ |
|||
Tvj=125℃ | 1.7 | ||||||
Tvj=150℃ | 2.7 | ||||||
Diode thermal resistance,junction-case |
RthJCD |
0.95 |
K /W |
||||
Operating Temperature |
TJop |
-40 |
150 |
℃ |
Output characteristic(typical) Output characteristic(typical)
IC = f (VCE) IC = f (VCE) Tvj= 150°C
IGBT
Transfer characteristic(typical) Switching losses IGBT (typical)
IC = f (VGE) E = f (RG)
VCE = 20V VGE = ±15V, IC = 50A, VCE = 600V
IGBT RBSOA
Switching losses IGBT (typical) Reverse bias safe operating area(RBSOA)
E = f (IC) IC =f (VCE)
VGE = ±15V, RG = 15Ω , VCE = 600V VGE = ±15V, Rgoff = 15Ω, Tvj = 150°C
Typical capacitance as a function of collector-emitter voltage Gate charge (typical)
C = f (VCE) VGE = f (QG)
f = 100 kHz, VGE = 0V IC = 50A, VCE = 600V
IGBT
IGBT transient thermal impedance as a function of pulse width Forward characteristic of Diode (typical)
Zth(j-c) = f (t) IF = f (VF)
Switching losses Diode(typical) Switching losses Diode(typical)
Erec = f (RG) Erec = f (IF)
IF = 50A, VCE = 600V RG = 15Ω, VCE = 600V
Diode transient thermal impedance as a function of pulse width
Zth(j-c) = f (t)
A "1200V 50A IGBT Half Bridge Module" is a power electronics device with two Insulated Gate Bipolar Transistors (IGBTs) configured in a half-bridge setup. It's designed for applications needing bidirectional control of current, with a maximum voltage of 1200 volts and a current capacity of 50 amperes. This module is commonly used in motor drives, inverters, and similar applications where precise control of both voltage and current is crucial. Proper cooling and gate drive circuitry are essential for reliable performance. Detailed specifications can be found in the manufacturer's datasheet.
Circuit diagram headline
Package outlines